preliminary datasheet agile nt alingap chipled package dimensions hsmx -c265 notes: 1. dimensions in mm. 2 . tolera nce 0. 1 m m unl ess ot her w i s e not e d . device selection guide part number color parts per reel h s m a - c 2 6 5 a m b e r 3 0 0 0 h s m c - c 2 6 5 r e d 3 0 0 0 h s m l - c 2 6 5 o r a n g e 3 0 0 0 h s m t - c 2 6 5 d e e p r e d 3 0 0 0 agilent technologies reserves the rig h t to alter pri ces, s p eci fications, featu r es, c a pabilities, functions, release dat e s, and re m ove ava ilability of the pr oduct( s) at any tim e.
absolute maximum ratings at t a = 25 c parameter hsma/c/l/t-c265 units dc forward current 25 ma power dissipation 65 mw reverse voltage (i r = 10 a) 5 v led junction temperature 95 c operating temperature range -30 to +85 c storage temperature range -40 to +85 c soldering temperature see soldering profile(figure 1) reverse voltage testing (tolerance: +/- 30%) electrical characteristics at t = 25 c a forward voltage v (volts) f @ i = 20 ma f part number t y p . m a x . reverse breakdown v r (volts) @ i r = 100 a min. hsma/c/l/t-c265 1 . 9 2 . 6 5 optical characteristics at t a = 25 c luminous intensity i (mcd) v @ 20 ma [1] part number m i n . t y p . peak wavelength p e a k (nm) typ. dominant wavelength d (nm) typ [2] . hsma-c265 2 8 . 5 7 5 5 9 5 5 9 2 h s m c - c 2 6 5 2 8 . 5 7 5 6 3 7 6 2 6 h s m l - c 2 6 5 2 8 . 5 7 5 6 0 9 6 0 5 h s m t - c 2 6 5 1 1 . 2 2 5 6 6 0 6 3 9 notes: 1. the luminous intensity i v is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength, d , is deriv ed from the cie chromaticity diagram and represents the perceived color of the device. agilent technologies reserves the rig h t to alter pri ces, s p eci fications, featu r es, c a pabilities, functions, release dat e s, and re m ove ava ilability of the pr oduct( s) at any tim e. 2
light inten s it y (iv ) bin limit [1] intensity (m cd) bin id min. max. a 0 . 1 1 0 . 1 8 b 0 . 1 8 0 . 2 9 c 0 . 2 9 0 . 4 5 d 0 . 4 5 0 . 7 2 e 0 . 7 2 1 . 1 0 f 1 . 1 0 1 . 8 0 g 1 . 8 0 2 . 8 0 h 2 . 8 0 4 . 5 0 j 4 . 5 0 7 . 2 0 k 7 . 2 0 1 1 . 2 0 l 1 1 . 2 0 1 8 . 0 0 m 1 8 . 0 0 2 8 . 5 0 n 2 8 . 5 0 4 5 . 0 0 p 4 5 . 0 0 7 1 . 5 0 q 7 1 . 5 0 1 1 2 . 5 0 r 1 1 2 . 5 0 1 8 0 . 0 0 s 1 8 0 . 0 0 2 8 5 . 0 0 t 2 8 5 . 0 0 4 5 0 . 0 0 u 4 5 0 . 0 0 7 1 5 . 0 0 v 7 1 5 . 0 0 1125.0 0 w 1 1 2 5 . 0 0 1800.0 0 x 1 8 0 0 . 0 0 2850.0 0 y 2 8 5 0 . 0 0 4500.0 0 tolerance: 15% note: 1. bin categories are estab lished for c lassification of product s. products may not be a vailable in all categories. please contact your agilent representative for information on currentl y available bins. amber color bin limits dominant wavelength (nm) bin id m i n . m a x . a 5 8 2 . 0 5 8 4 . 5 b 5 8 4 . 5 5 8 7 . 0 c 5 8 7 . 0 5 8 9 . 5 d 5 8 9 . 5 5 9 2 . 0 e 5 9 2 . 0 5 9 4 . 5 f 5 9 4 . 5 5 9 7 . 0 tolerance : + / - 1 nm red color bin limits dominant wavelength (nm) bin id m i n . m a x . - 6 1 5 . 0 6 3 0 . 0 tolerance : + / - 1 nm agilent technologies reserves the rig h t to alter pri ces, s p eci fications, featu r es, c a pabilities, functions, release dat e s, and re m ove ava ilability of the pr oduct( s) at any tim e. 3
orange color bin limits dominant wavelength (nm) bin id m i n . m a x . a 5 9 7 . 0 6 0 0 . 0 b 6 0 0 . 0 6 0 3 . 0 c 6 0 3 . 0 6 0 6 . 0 d 6 0 6 . 0 6 0 9 . 0 e 6 0 9 . 0 6 1 2 . 0 f 6 1 2 . 0 6 1 5 . 0 tolerance : + / - 1 nm deep red color bin limits dominant wavelength (nm) bin id m i n . m a x . - 6 3 5 . 0 6 4 6 . 0 tolerance : + / - 1 nm t e m perat ure ti m e 1 0 sec. m ax. 230 o c m ax. 140- 160 o c 4 o c/ sec m a x . o ver 2 m i n. 4 o c/ sec m ax. -3 o c/ se c m ax. figure 1: recommended reflow soldering profile figure 2: recommended soldering pattern agilent technologies reserves the rig h t to alter pri ces, s p eci fications, featu r es, c a pabilities, functions, release dat e s, and re m ove ava ilability of the pr oduct( s) at any tim e. 4
agilent technologies reserves the rig h t to alter pri ces, s p eci fications, featu r es, c a pabilities, functions, release dat e s, and re m ove ava ilability of the pr oduct( s) at any tim e. 5 figure 3: tape dimensions there shall be a minimum of 160mm (6.3in.) of empty component pockets sealed with cover tape. mounted with components. there shall be a minimum of 160mm (6.3in.) of empty component pockets sealed with cover tape. minimum of 230mm (9.05in.) may consist of carrier and/or cover tape end start convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components . storage condition : 5 to 30 o c @ 60%rh max. baking is required under the condition : a) the blue silica gel indicator becoming white / transparent color b) the pack has been open for more than 1 week baking recommended condition : 60 5 o c for 20 hrs figure 4: tape leader and trailer dimensions. notes: 1. all dimensions in millimeters (inches). 2 . t o l e r a n c e is www.se m i conductor.agilent.co m dat a sub j ect to change. copyright 2003 agilent te chnolo gies, inc. revisio n da t e : xx -xx - xx xx
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